Yao Yang said in an interview, because the United States of America’s on our chip suppression, so we have to go to develop this photonic chip, so it is possible that we are ahead of the curve. In this kind of decoupling and breaking the chain of this kind of situation, I have confidence. First of all, the first is the traditional chip, electronic chip we are also slowly breakthrough. Huawei has just come out with this mate 60, and has not yet formally announced what it uses for its chip, we will wait and see. But I’m afraid that the future is the world of photonic chips, it is very likely that we are changing lanes to overtake, like high-speed rail, like new energy vehicles, changing lanes not to play with you before, the Americans came to limit us is to move a stone to stone their own feet. He is not just killing the enemy a thousand to his own detriment, he may be in turn to kill the enemy a thousand to his own detriment of 1500. because China he after these twenty years of accumulation, capital has. Human resources also improved, with these two and the market, this is our killer app, the market is big enough, the United States and then give us decoupling exercise, his scientific research no way off. He can not do. This news has attracted widespread attention and heated debate, for China’s position in the global chip competition and future development is also of great significance.

First of all, this news shows that Chinese companies have begun to get involved in the field of photonic chips, and the scale of investment is not small. As the global chip industry competition continues to intensify, the traditional chip has entered a bottleneck, while the photonic chip has a higher speed and lower energy consumption, the future will become an important direction of the chip industry. In this field of research and application, Chinese enterprises have also actively layout and step up to catch up. Therefore, Yao’s words not only show the importance and investment of Chinese companies in the field of photonic chips, but also reveal the determination and strength of Chinese companies in technological innovation and industrial upgrading.

Secondly, Yao’s words also imply that China’s strength in independent R&D and manufacturing of chips is gradually improving. Optoelectronic hybrid chip is a new chip that integrates the advantages of electronic chip and photonic chip, which can be characterized by high speed, consumption, high reliability and scalability at the same time. The research and application in this field requires a lot of human and material resources, as well as a high degree of technical accumulation and innovation ability. The fact that Chinese enterprises have been able to make such remarkable progress in just a few years shows that China’s strength in independent chip research and development and manufacturing is gradually improving, which is also an important advantage for China in the global chip competition.

Finally, Yao Yang’s words also revealed that the Chinese government attaches great importance to and supports scientific and technological innovation and industrial upgrading. In recent years, the Chinese government has been encouraging and supporting enterprises to increase investment in scientific and technological innovation and industrial upgrading, promoting China’s position and influence in global scientific and technological innovation and industrial competition. As an important direction of the new generation of chips, the research and application of optical hybrid chips is of great significance in promoting the upgrading and development of China’s chip industry in the world.

To summarize, the news that some enterprises have begun to invest in the research and development of photonic chips and plan to come up with prototypes of optoelectronic hybrid chips by the end of this year and practical commercial chips in about three years, as revealed by Yao Yang, director of the National Development Research Institute of Peking University, is of great significance to China’s position and future development in the global chip competition. This news shows that Chinese companies have begun to get involved in the field of photonic chips and step up to catch up with the world’s leading level, but also reveals that China’s strength in the independent research and development and manufacturing of chips is gradually improving. It also reveals that China’s strength in independent R&D and manufacturing of chips is gradually improving. At the same time, this is also inseparable from the Chinese government’s great attention and support to scientific and technological innovation and industrial upgrading.

With the increasing competition in the global chip industry and China’s continuous efforts in technological innovation and industrial upgrading, China’s position in the global chip industry will become more and more important in the future. China’s investment and development in the field of photonic chips will also bring new opportunities and challenges for global technological innovation and industrial upgrading. Let’s wait and see the future development of China in the global chip competition, and believe that China will make more brilliant achievements in scientific and technological innovation and industrial upgrading.

According to media sources, TSMC has joined hands with Broadcom, NVIDIA and other major customers to jointly develop new products such as silicon photonics technology and co-packaged optical components, and the process technology has been extended from 45nm to 7nm, which will usher in a large order starting as early as the second half of next year, and is expected to step into the stage of releasing the volume output in 2025.

With the rapid development of technology and the increase in computer processing speed, communication between chips has become a key factor in computing performance. Silicon photonics has the potential to increase the speed of optoelectronic transmission and solve the current problems of signal loss and heat from copper wiring in computer components. As a result, semiconductor giants such as TSMC and Intel have invested in related R&D. Semiconductor industry introduced a solution, is the silicon photonics optics and switch special application chip (ASIC), through the CPO packaging technology integrated into a single module, this program has begun to obtain Microsoft, Meta and other major manufacturers to certify and use in the new generation of network architecture.

Silicon photonics technology has already demonstrated broad application prospects and industrialization trends in data centers, communications, LIDAR, sensing, high-performance computing and artificial intelligence.