This still makes no sense, because the gold wiring is a huge cost. Why dafuq wouldn’t current manufacturing encourage smaller packages? And there has been a push to make things thinner since ad memorium, so why wouldn’t they have made the die slimmer?
They’re referencing the package as a whole, plastic casing, gold internal wiring, etc. and the silicon die in the center of it all.
This still makes no sense, because the gold wiring is a huge cost. Why dafuq wouldn’t current manufacturing encourage smaller packages? And there has been a push to make things thinner since ad memorium, so why wouldn’t they have made the die slimmer?